LT Technologies, LLC. (LTT) is developing a cavity-less microwave technology capable of generating high-power, short-duration, spatially uniform, and material-specific energy pulses.  The technology can be used to fill a fundamental need in the Rapid Thermal Processing (RTP) part of the semiconductor fabrication process, as well as the packaging & bonding of microelectronics.

LTT’s approach enables the batch treatment of large wafers with surgically targeted affects within the wafer volume. Current RTP and bonding technologies produce wide scale effects at the wafer surface and have difficulty selectively targeting non-surface features. The cavityless nature of the underlying technology allows for a spatially uniform solution while enabling a drop-in replacement of other RTP methods in existing semiconductor fabrication and device interconnection and bonding manufacturing streams.